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| (R) STPS2L40U LOW DROP POWER SCHOTTKY RECTIFIER MAIN PRODUCT CHARACTERISTICS IF(AV) VRRM Tj (max) VF (max) FEATURES AND BENEFITS n n n n n 2A 40 V 150 C 0.34 V VERY SMALL CONDUCTION LOSSES NEGLIGIBLE SWITCHING LOSSES LOW FORWARD VOLTAGE DROP SURFACE MOUNT MINIATURE PACKAGE AVALANCHE CAPABILITY SPECIFIED SMB (JEDEC DO-214AA) DESCRIPTION Single chip Schottky rectifiers suited to Switched Mode Power Supplies and high frequency DC to DC converters. Packaged in SMB, this device is especially intended for surface mounting and used in low voltage, high frequency inverters, free wheeling and polarity protection applications. ABSOLUTE RATINGS (limiting values) Symbol VRRM IF(RMS) IF(AV) IFSM PARM Tstg Tj dV/dt Parameter Repetitive peak reverse voltage RMS forward current Average forward current Surge non repetitive forward current Repetitive peak avalanche power Storage temperature range Maximum operating junction temperature * Critical rate of rise of reverse voltage TL = 130C = 0.5 tp = 10 ms Sinusoidal tp = 1s Tj = 25C Value 40 8 2 75 2200 - 65 to + 150 150 10000 Unit V A A A W C C V/s *: dPtot 1 thermal runaway condition for a diode on its own heatsink < dTj Rth( j - a ) 1/5 July 2003 - Ed: 2A STPS2L40U THERMAL RESISTANCES Symbol Rth (j-l) Junction to lead Parameter SMB Value 20 Unit C/W STATIC ELECTRICAL CHARACTERISTICS Symbol IR * Tests Conditions Reverse leakage current Tests Conditions Tj = 25C Tj = 100C Tj = 125C VF * Forward voltage drop Tj = 25C Tj = 125C Tj = 25C Tj = 125C Tj = 25C Tj = 125C Pulse test : * tp = 380s, < 2% Min. Typ. Max. 220 20 Unit A mA mA V VR = 40 V 38 IF = 1 A 0.25 IF = 2 A 0.31 IF = 4 A 0.39 80 0.39 0.28 0.43 0.34 0.5 0.45 V To evaluate the maximum conduction losses use the following equation : P = 0.22 x IF(AV) + 0.06 IF2(RMS) Fig. 1: Average forward power dissipation versus average forward current. PF(av)(W) 1.0 0.8 =1 = 0.05 Fig. 2: Average forward current versus ambient temperature (=0.5). IF(av)(A) = 0.1 = 0.2 = 0.5 2.4 Rth(j-a)=Rth(j-l) 2.0 1.6 Rth(j-a)=100C/W 0.6 0.4 T 1.2 0.8 T 0.2 IF(av) (A) =tp/T tp 0.4 0.0 =tp/T tp Tamb(C) 50 75 100 125 150 0.0 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 0 25 2/5 STPS2L40U Fig. 3: Normalized avalanche power derating versus pulse duration. PARM(tp) PARM(1s) 1 Fig. 4: Normalized avalanche power derating versus junction temperature. PARM(tp) PARM(25C) 1.2 1 0.1 0.8 0.6 0.01 0.4 0.2 0.001 0.01 0.1 1 tp(s) 10 100 1000 Tj(C) 0 0 25 50 75 100 125 150 Fig. 5: Non repetitive surge peak forward current versus overload duration (maximum values). IM(A) 12 10 8 6 4 2 IM t Fig. 6: Relative variation of thermal impedance junction to ambient versus pulse duration. Zth(j-a)/Rth(j-a) 1.0 0.8 Ta=25C 0.6 0.4 = 0.5 Ta=50C Ta=100C = 0.2 T 0.2 =0.5 = 0.1 Single pulse t(s) 1E-2 1E-1 1E+0 tp(s) 1E-1 1E+0 1E+1 =tp/T tp 0 1E-3 0.0 1E-2 1E+2 1E+3 Fig. 7: Reverse leakage current versus reverse voltage applied (typical values). IR(mA) 1E+2 Tj=125C Fig. 8: Junction capacitance versus reverse voltage applied (typical values). C(pF) 1000 F=1MHz Tj=25C 1E+1 1E+0 100 1E-1 Tj=25C 1E-2 VR(V) 1E-3 0 5 10 15 20 25 30 35 40 VR(V) 10 1 10 100 3/5 STPS1L40A/U Fig. 9-1: Forward voltage drop versus forward current (maximum values, high level). IFM(A) 10.00 Tj=125C Tj=125C (typical values) Tj=25C Fig. 9-2: Forward voltage drop versus forward current (maximum values, low level). IFM(A) 3.0 2.5 2.0 1.5 Tj=125C Tj=125C (typical values) Tj=25C 1.00 0.10 VFM(mV) 0.01 0 50 100 150 200 250 300 350 400 450 500 550 600 650 700 1.0 0.5 VFM(mV) 0.0 0 50 100 150 200 250 300 350 400 450 500 Fig. 10: Thermal resistance junction to ambient versus copper surface under each lead (Epoxy printed circuit board FR4, copper thickness s(Cu) = 35m) Rth(j-a) (C/W) 120 100 80 60 40 20 S(Cu) (cm) 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 4/5 STPS2L40U PACKAGE MECHANICAL DATA SMB DIMENSIONS E1 REF. Millimeters Min. Max. 2.45 0.20 2.20 0.41 5.60 4.60 3.95 1.60 Inches Min. 0.075 0.002 0.077 0.006 0.201 0.159 0.130 0.030 Max. 0.096 0.008 0.087 0.016 0.220 0.181 0.156 0.063 D A1 A2 b 1.90 0.05 1.95 0.15 5.10 4.05 3.30 0.75 E c A1 E E1 b C L A2 D L FOOT PRINT DIMENSIONS (in millimeters) 2.3 1.52 2.75 1.52 Ordering type STPS2L40U n n Marking GD4 Package SMB Weight 0.107g Base qty 2500 Delivery mode Tape & reel BAND INDICATES CATHODE EPOXY MEETS UL94,V0 Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics (c) 2003 STMicroelectronics - Printed in Italy - All rights reserved. STMicroelectronics GROUP OF COMPANIES Australia - Brazil - Canada - China - Finland - France - Germany Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco - Singapore Spain - Sweden - Switzerland - United Kingdom - United States. http://www.st.com 5/5 |
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